IBM & 3M: Collaboration for Product Development
8. September 2011
Today the two companies announced that they are going to jointly develop the world’s first adhesive that can be used to stack semiconductors into “silicon towers.” This new material, so the companies plan, will allow the building of commercial microprocessors that would be composed of layers of up to 100 separate chips.
The message here: Think about how suppliers can become collaborators in your product development efforts.